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Mon, 13 Feb 2017 03:37:00 -0800 (PST) MIME-Version: 1.0 Received: by 10.182.233.48 with HTTP; Mon, 13 Feb 2017 03:36:40 -0800 (PST) From: Andrei Chis Date: Mon, 13 Feb 2017 12:36:40 +0100 X-Gmail-Original-Message-ID: Message-ID: To: caml-list@inria.fr Content-Type: text/plain; charset=UTF-8 Content-Transfer-Encoding: quoted-printable Subject: [Caml-list] 1st CfP: SLE 2017 (10th ACM SIGPLAN International Conference on Software Language Engineering) =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D **Call for Papers** 10th ACM SIGPLAN International Conference on Software Language Engineering (SLE 2017) 23-24 October 2017, Vancouver, Canada (Co-located with SPLASH 2017) General chair: Benoit Combemale, University of Rennes 1, France Program co-chairs: Marjan Mernik, University of Maribor, Slovenia Bernhard Rumpe, RWTH Aachen University, Germany Artifact evaluation chairs Tanja Mayerhofer, TU Wien, Austria Laurence Tratt, King's College London, UK http://conf.researchr.org/track/sle-2017/sle-2017-papers http://www.sleconf.org/2017 Follow us on twitter: https://twitter.com/sleconf =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D Software Language Engineering (SLE) is the application of systematic, disciplined, and measurable approaches to the development, use, deployment, and maintenance of software languages. The term "software language" is used broadly, and includes: general-purpose programming languages; domain-specific languages (e.g. BPMN, Simulink, Modelica); modeling and metamodeling languages (e.g. SysML and UML); data models and ontologies (e.g. XML-based and OWL-based languages and vocabularies). ### Important Dates Fri 2 Jun 2017 - Abstract Submission Fri 9 Jun 2017 - Paper Submission Fri 4 Aug 2017 - Author Notification Thu 10 Aug 2017 - Artifact Submission Fri 1 Sep 2017 - Artifact Notification Fri 8 Sep 2017 - Camera Ready Deadline Sun 22 Oct - SLE workshops Mon 23 Oct - Tue 24 Oct 2017 - SLE Conference ### Topics of Interest SLE aims to be broad-minded and inclusive about relevance and scope. We solicit high-quality contributions in areas ranging from theoretical and conceptual contributions to tools, techniques, and frameworks in the domain of language engineering. Topics relevant to SLE cover generic aspects of software languages development rather than aspects of engineering a specific language. In particular, SLE is interested in principled engineering approaches and techniques in the following areas: * Language Design and Implementation * Approaches and methodologies for language design * Static semantics (e.g., design rules, well-formedness constraints) * Techniques for behavioral / executable semantics * Generative approaches (incl. code synthesis, compilation) * Meta-languages, meta-tools, language workbenches * Language Validation * Verification and formal methods for languages * Testing techniques for languages * Simulation techniques for languages * Language Integration and Composition * Coordination of heterogeneous languages and tools * Mappings between languages (incl. transformation languages) * Traceability between languages * Deployment of languages to different platforms * Language Maintenance * Software language reuse * Language evolution * Language families and variability * Domain-specific approaches for any aspects of SLE (design, implementation, validation, maintenance) * Empirical evaluation and experience reports of language engineering tools * User studies evaluating usability * Performance benchmarks * Industrial applications ### Types of Submissions * **Research papers**: These should report a substantial research contribution to SLE or successful application of SLE techniques or both. Full paper submissions must not exceed 12 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/). * **Tool papers**: Because of SLE's interest in tools, we seek papers that present software tools related to the field of SLE. Selection criteria include originality of the tool, its innovative aspects, and relevance to SLE. Any of the SLE topics of interest are appropriate areas for tool demonstrations. Submissions must provide a tool description of 4 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/), and a demonstration outline including screenshots of up to 6 pages. Tool demonstrations must have the keywords =E2=80=9CTool Demo=E2=80=9D or =E2=80= =9CTool Demonstration=E2=80=9D in the title. The 4-page tool description will, if t= he demonstration is accepted, be published in the proceedings. The 6-page demonstration outline will be used by the program committee only for evaluating the submission. * **Industrial papers**: These should describe real-world application scenarios of SLE in industry, explained in their context with an analysis of the challenges that were overcome and the lessons which the audience can learn from this experience. Industry paper submissions must not exceed 6 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/). * **New ideas / vision papers**: New ideas papers should describe new, non-conventional SLE research approaches that depart from standard practice. They are intended to describe well-defined research ideas that are at an early stage of investigation. Vision papers are intended to present new unifying theories about existing SLE research that can lead to the development of new technologies or approaches. New ideas / vision papers must not exceed 4 pages including bibliography in ACM SIGPLAN conference style (http://www.sigplan.org/Resources/Author/). ### Artifact evaluation Authors of accepted papers at SLE 2017 are encouraged to submit their experiment results used for underpinning research statements to an artifact evaluation process. This submission is voluntary and will not influence the final decision regarding the papers. Papers that go through the Artifact Evaluation process successfully receive a seal of approval printed on the first page of the paper in the proceedings. Authors of papers with accepted artifacts are encouraged to make these materials publicly available upon publication of the proceedings, by including them as "source materials" in the ACM Digital Library. ### Publications All submitted papers will be reviewed by at least three members of the program committee. All accepted papers, including tool papers, industrial papers and new ideas / vision papers will be published in ACM Digital Library. Selected accepted papers will be invited to a special issue of the Computer Languages, Systems and Structures (COMLAN) journal. ### Awards * **Distinguished paper**: Award for most notable paper, as determined by the PC chairs based on the recommendations of the program committee. * **Distinguished reviewer**: Award for distinguished reviewer, as determined by the PC chairs using feedback from the authors. * **Distinguished artifact**: Award for the artifact most significantly exceeding expectations, as determined by the AEC chairs based on the recommendations of the artifact evaluation committee. ### Program Committee Marjan Mernik (co-chair), University of Maribor, Slovenia Bernhard Rumpe (co-chair), RWTH Aachen University, Germany Christian Berger, Chalmers, Sweden Mark van den Brand, TU Eindhoven, The Netherlands Ruth Breu, University of Innsbruck, Austria Jordi Cabot, ICREA, Spain Walter Cazzola, University of Milan, Italy Marsha Chechik, University of Toronto, Canada Tony Clark, Middlesex University, UK Tom Dinkelaker, Ericsson, Germany Bernd Fischer, Stellenbosch University, South Africa Sebastian Gerard, CEA, France Jeff Gray, University of Alabama, USA Esther Guerra, Autonomous University of Madrid, Spain Michael Homer, Victoria University of Wellington, New Zealand Ralf L=C3=A4mmel, University of Koblenz-Landau, Germany Tihamer Levendovszky, Microsoft, USA Gunter Mussbacher, McGill University, Canada Terence Parr, University of San Francisco, USA Jaroslav Porub=C3=A4n, University of Ko=C5=A1ice, Slovakia Jan Ringert, Tel Aviv University, Israel Julia Rubin, University of British Columbia, Canada Tony Sloane, Macquarie University, Australia Eugene Syriani, University of Montreal, Canada Emma S=C3=B6derberg, Google, Denmark Eric Van Wyk, University of Minnesota, USA Jurgen Vinju, CWI, Netherlands Eric Walkingshaw, Oregon State University, USA Andreas Wortmann, RWTH Aachen University, Germany Tian Zhang, Nanjing University, China ### Contact For any question, please contact the organizers via email: sle2017@inria.fr