New comment by lane-brain on void-packages repository https://github.com/void-linux/void-packages/pull/28785#issuecomment-780002696 Comment: @ericonr I have some good news! I've been able to rewrite the template to resolve a lot of the issues. I resolved nearly all of the errors from xlint, the only one is the license issue but afaik I am supposed to include the runtime exception license. I've included a version of the patch you specified, symlinked the directories, and symlinked the individual patches in files/ because I needed to include the musl patch. Additionally I've been able to get successful cross builds for x86_64-musl and armv7l, and I am crossing my fingers for other archs. Runtime tests on emacs-nativecomp confirm that we get working elc compilation. I apologize for the bad commit @50c7abf, I made a mistake with the relative symlinks. A crucial change for working cross builds consisted in removing the -devel packages and going to the original distfiles defs that unpacked the source packages directly to the build dir. For whatever reason, the {gmp,mpf,*}-devel packages failed citing an unresolvable shlib at libc.so on cross builds. I worry that this may increase the build times, and am generally curious why this error would occur. Without these devel packages, the build failed citing an error with these subpackages needing to be compiled with -fPIC. Adding this to the compiler flags made for a working build. I needed to retain the _triplets var defined in the original gcc package, because XBPS_TARGET_TRIPLET is empty at the do_install phase and it needs to be defined at that stage to set the correct header install paths. One last thing, the soname needs to be added to shlibs. I was unsure whether it was appropriate to include this modification in the commit or whether this change was to be made by the void team, so let me know what is best. Build tests are in progress, let's see how it pans out.