New review comment by q66 on void-packages repository https://github.com/void-linux/void-packages/pull/31706#discussion_r662359071 Comment: 1) in the past things have been overly lax (until recently there wasn't even CI with unit tests) 2) with most things it's generally safe to assume things work okay, since most things don't have platform specific code, and weren't developed with any specific platform in mind 3) this is a thing that explicitly has platform specific code, and is developed with a single platform in mind for the time being considering making this work for cross targets involves special compiler setup that complicates the template, and fixing other targets appears to require patching, and even if you do make it build it will not be tested, i don't see any reason to include it in the packages - and i can pretty much guarantee you that there will be zero users trying to link with mold from an arm/ppc/whatever host to x86_64 target (until recently we didn't even ship cross-compilers to x86_64 and nobody complained for years, until i went ahead and added them)