There's a merged pull request on the void-packages repository

linux-firmware: subpackage for Qualcomm SoCs.
https://github.com/void-linux/void-packages/pull/32146

Description:
<!-- Mark items with [x] where applicable -->

#### General
- [ ] This is a new package and it conforms to the [quality requirements](https://github.com/void-linux/void-packages/blob/master/Manual.md#quality-requirements)

#### Have the results of the proposed changes been tested?
- [x] I use the packages affected by the proposed changes on a regular basis and confirm this PR works for me
- [ ] I generally don't use the affected packages but briefly tested this PR

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  - [ ] armv6l-musl
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Split from #31435 (`Qualcomm updates`) as suggested, also contains some discussion already about this subpackage.